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    • Denggle > Lighting News >

    3D Image Sensor: Infineon Made Smartphone More Easily Unlocked By Face Recognition

    3D Image Sensor: Infineon Made Smartphone More Easily Unlocked By Face Recognition

    Source： http://www.ledinside.com/ 09 Jan 2018
    3D Image Sensor Infineon

    mobile communications is to unlock smartphones by 3D face recognition rather than fingerprint or PIN, it also make authentication more convenient and more secure.Also, the advantages of Time-of-flight support would rapid market growth.

     

    One megatrend feature in mobile communications is to unlock smartphones by 3D face recognition instead of fingerprint or PIN. Making authentication more convenient and more secure, it may soon become indispensable for mobile payment applications and mobile ID. With the 3D image sensor chip from Infineon Technologies the unlock-with-your-face feature becomes smarter, faster and more reliable.

     

    Together with its innovation partner pmdtechnologies AG, Infineon has developed a new 3D image sensor in its REAL3™ chip family, based on Time-of-flight (ToF) technology. It enables the world’s smallest camera module for integration in smartphones with a footprint of less than 12 mm x 8 mm, including the receiving optics and VCSEL (Vertical-Cavity Surface-Emitting Laser) illumination.


    Infineon and pmdtechnologies will present their product innovation at CES 2018. Produced in Dresden and developed in Munich and Graz, the chip comes with expertise from Germany and Austria.

     

    3D Image Sensor: Infineon Made Smartphone More Easily Unlocked By Face Recognition

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