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More and more companies, big and small, have utilized their self-developed methods to produce Micro LED products, whether they are Micro LED TVs, display modules, head-up displays (HUDs), or microdisplays. Through numerous collaborations between LED manufacturers and equipment providers, the production of Micro LED chips started to slightly increase. Research institutions have been trying to realize their ideas, trial after trial, to improve mass transfer technologies. As for young startups, they also devised several intricate technologies that can effectively address some of the technology barriers, which is attractive enough to get them helpful partners.
JBD, a HK-based startup founded in 2015, carried out extensive research and development work to realize inorganic compound semiconductor material based display technology. Near the end of 2017, JBD introduced a new Micro LED technology for microdisplay manufacturing. LEDinside contacted Dr. Fang Ou, CTO, and Dr. Lei Zhang, CEO of JBD, and got the information about the technique in detail.
Flip-chip Technology vs. Hybrid Integration Technology
At present, among Micro LED developers, the most universal approach to produce Micro LED microdisplays is the flip-chip technology, said Dr. Zhang. Basically, they manufacture two wafers, one of which carries a layer of light emitter and the other the IC driver. Then, the wafer which carries Micro LEDs is diced into separate chips and flip-bonded on to the wafer with IC driver via solder bonding.
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